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MOSFET Modeling With SPICE: Principles and Practice By Daniel Foty
Download MOSFET Modeling With SPICE: Principles and Practice By Daniel Foty
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- Sales Rank: #1299231 in Books
- Published on: 1997-01-03
- Ingredients: Example Ingredients
- Original language: English
- Number of items: 1
- Dimensions: 9.00" h x 1.30" w x 7.00" l, 2.37 pounds
- Binding: Hardcover
- 653 pages
From the Publisher
The guide to MOSFET modeling that every practicing CMOS integrated circuit designer has been waiting for. This book will help CMOS circuit designers make the best possible use of SPICE models, and will prepare them for new models that may soon be introduced. It introduces SPICE modeling and its use in CMOS circuit design. It presents the formalism of model building and the semiconductor physics of MOS structures. It covers each important SPICE model, showing how to choose the appropriate model. It discusses the popular HSPICE Level 28, as well as Levels 1-3, BSIM 1-3, and MOS Model 9. The book presents techniques for accounting for systematic process variations, and describes new model candidates, including the Power-Lane Model, the PCIM Model, and the EKV Model. It includes extensive examples throughout. For practicing engineers and scientists in the semiconductor industry; engineering faculty and students.
From the Back Cover
This book will help CMOS circuit designers make the best possible use of SPICE models, and will prepare them for new models that may soon be introduced.Introduces SPICE modeling and its use in CMOS circuit design. Presents the formalism of model building and the semiconductor physics of MOS structures. Covers each important SPICE model, showing how to choose the appropriate model. Discusses the popular HSPICE Level 28, as well as Levels 1-3, BSIM 1-3, and MOS Model 9. Presents techniques for accounting for systematic process variations. Describes new model candidates, including the Power-Lane Model, the PCIM Model, and the EKV Model. Includes extensive examples throughout.Practicing engineers and scientists in the semiconductor industry; engineering faculty and students.
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